Exhibit at "SEMICON Japan 2024"

Event Overview

Venue Tokyo Big Sight
Admission fee [Free] Advance registration
Dates Held December 11 (Wed)~ December 13 (Fri), 2024 (3 days)
Exhibition times (offline) Each day 10:00 ~ 17:00
Outline of our Exhibit

We are pleased to introduce our proprietary technologies and the latest information on process components and test components that leverage these technologies.

・Testing Devces

　Test components used in wafer testing and final testing.


　Test sockets, probe heads, Microcontactor🄬 (contact probes).


・Semiconductor Process Components (Advanced Bonding Components):

　Process components used in front-end deposition and etching equipment.

 

　Heaters, cooling plates, shower heads.

 

 

We invite you to visit our booth to learn more about our innovative solutions and how they can benefit your processes.
Organizer SEMI Japan

SEMICON Japan is an international exhibition for electronics manufacturing, covering manufacturing technologies, equipment, and materials for the semiconductor industry, as well as SMART applications such as cars and IoT devices.

semiconjapan2024_img1(Image of our booth)

■ Main Products/Technologies Exhibited

★ Testing Devices

  • In addition to probes and test sockets for high frequency, we will exhibit a group of test sockets that meet customer needs, as well as “highly durable, low solder adhesion plunger materials” developed in-house by a metal product manufacturer.

★ Semiconductor Process Components

  • We will exhibit critical parts for semiconductor processes, such as multi-layer shower heads, metal cooling plates with thermal spraying, multi-zone heaters, and other products produced by our “advanced joining technology”.
    We will introduce our advanced brazing using brazing materials developed in-house, contamination-free diffusion bonding, and other technologies indispensable for precise semiconductor processes.