Bonding Technology

Leveraging our advanced metal bonding technologies, including our proprietary brazing and solid-phase diffusion technologies, NHK Spring develops and manufactures critical parts for semiconductor manufacturing equipment, which requires high bonding accuracy.

For brazing, we have developed and use our own highly reliable brazing materials, and we guarantee the quality of our products through integrated in-house production.

One of the features of our bonding technology is that heat treatment is performed under uniform temperature in a vacuum, thereby reducing residual strain compared to welding, and making it possible to bond even complex shapes. In addition, solid-phase diffusion bonding is a clean bonding method that prevents molten brazing material residues arising inside inner channels.

Through conducting such advanced bonding, we can realize accurate temperature control and gas distribution, which are important in processes for manufacturing increasingly miniaturized and laminated semiconductors.