Semiconductor Process Parts

Cooling Plates (Semiconductor Process Components)

PRODUCT NAME	Cooling Plates (Semiconductor Process Components)
PRODUCT CATEGORY	Semiconductor Process Parts
INDUSTRY/SITUATION OF USE	Information and Communication Related / Semiconductor Manufacturing Equipment
FUNCTIONS	Cooling
OUTLINE	These cooling plates are intended for electrostatic chucks mainly used in the etching process of semiconductor manufacturing. They control the temperature of semiconductor substrates with high precision.
CHARACTERISTICS	Thermal spraying of ceramics on metal surfaces can enhance electrical insulation and corrosion resistance.

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In addition to the conventional aluminum cooling plate, we have developed a titanium cooling plate that combines diffusion bonding and thermal spraying technologies. Since the thermal expansion coefficient is close to that of the thermal spraying film, the titanium cooling plate exhibits even better durability than the aluminum cooling plate in both high and low temperature environments.