Direct Bonded Insulator Circuit (DB-I/C)
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PRODUCT NAME
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Direct Bonded Insulator Circuit (DB-I/C)
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PRODUCT CATEGORY
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Integrated Metal Substrate (IMS)
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INDUSTRY/SITUATION OF USE
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Industry & Life Related, Factory & Plant
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FUNCTIONS
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Heat Dissipation, Conduction
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OUTLINE
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This product endowed with an integrated heat sink structure has been developed from heat-dissipating substrate. It is used for power semiconductor applications such as drive inverters, IGBT modules, and SiC applications.
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CHARACTERISTICS
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Integrating the substrate with the cooler eliminates the need for "soldering" and "heat dissipation sheets", thereby lowering thermal resistance and effectively reducing the heat generated by the power semiconductors. In addition, thick copper circuits of up to 2.0 mm can be formed, allowing large currents to flow.
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