Integrated Metal Substrate (IMS)
These metal substrates are based on aluminum, copper, and iron. Used for LEDs, inverters, small motors, etc.
Direct Bonded Insulator Circuit (DB-I/C)
This development product is a heat-dissipating substrate having a heat sink-integrated structure. We anticipate that it will be used for power semiconductors such as drive inverters, IGBT modules, and SiC applications.