Product Type

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Integrated Metal Substrate (IMS)

These substrates take advantage of the characteristics of metals. It demonstrates excellent performance in applications requiring high heat dissipation, and is used for LEDs, inverters, small motors, etc.

Aluminum Substrate

Aluminum Substrate

This aluminum-based substrate is endowed with excellent workability and heat dissipation performance. It is widely used mainly in automotive applications.

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Copper Substrate

Copper Substrate

Endowed with excellent heat dissipation performance, this copper-based substrate is used for applications requiring high heat dissipation.

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Iron Substrate

Iron Substrate

This iron-based substrate is endowed with excellent workability and better heat dissipation performance than resin substrate.

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Direct Bonded Insulator Circuit (DB-I/C)

Direct Bonded Insulator Circuit (DB-I/C)

This development product is a heat-dissipating substrate having a heat sink-integrated structure. We anticipate that it will be used for power semiconductors such as drive inverters, IGBT modules, and SiC applications.

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